3D-01661 suction chuck
It is a Y-shaped vacuum suction chuck.
It is suitable for transporting 300mm wafer sizes (random access compatible). It is widely used in atmospheric environment robots and holds the back surface of the workpiece by vacuum suction (negative pressure). By applying a conductive Teflon coating to the chuck surface, it prevents the transported workpieces from damage and scratches caused by static electricity.
- Company：ジェーイーエル
- Price：Other
